| 摘要 |
PROBLEM TO BE SOLVED: To suppress the floating of outer leads for bringing a bonding pad and the outer leads on a substrate into complete contact by a method wherein metallic pieces are mounted on the outer leads of tape carrier packages laminated on bonding pads of the substrate to be reflow packaged. SOLUTION: Bonding agents 12 such as solder paste or solder plating are added to bonding pads 10 formed on a substrate 9. Next, outer leads 7 of tape carrier packages are aligned with the bonding pads 10 to be mounted thereon. Next, the molten bonding agents 12 creep up metallic pieces 13 to form fillet state for bonding. At this time, the metallic pieces 13 mounted on the outer leads 7 are required of sufficient weight for suppressing the lead floating to be set up according to the width and thickness of the outer leads 7. |
