发明名称 CUTTING OF WORK BY WIRE SAW
摘要 PROBLEM TO BE SOLVED: To make it possible to cut a work with an internal cavity without causing a significant variation in cutting resistance by cutting the work by bringing it into contact with wire between fabricating rollers in such a state that a dummy material is loaded in the internal cavity of the work. SOLUTION: An inner dummy material 34 of epoxy resin is loaded into the central cavity part 21a of a work 21 of a hollow cylindrical shape, and is fixed with an adhesive to obtain a work 21 of a solid cylindrical shape. Further, a mounting plate 36 of glass is firmly bonded through a carbon 35. In addition, the work 21 is set, in freely detachable manner, on a work support mechanism for a wire saw, and is fabricated by cutting to the specified thickness. Consequently, it is possible to cut the work 21 with an internal cavity without causing a significant variation in cutting resistance. Besides, the variation of the facing roughness in the cut section of a wafer can be inhibited when such a variation is likely to occur depending upon a spot where the cutting takes place. Thus the wafer manufactured is of the high quality under the described damage inhibitory effects.
申请公布号 JPH1076517(A) 申请公布日期 1998.03.24
申请号 JP19960233876 申请日期 1996.09.04
申请人 NIPPEI TOYAMA CORP 发明人 TAKAHASHI KATSUMASA;HOU SHISHIYOU
分类号 B24B27/06;B28D5/04;(IPC1-7):B28D5/04 主分类号 B24B27/06
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