| 摘要 |
PROBLEM TO BE SOLVED: To separate wafers bonded by suction to speedily and automatically separate pairs of wafers, lessening the importance of positioning. SOLUTION: An apparatus for separating wafers has at least one structure consisting of at least two flexible elements with a width in the direction vertical to a plane of wafers being smaller than the maximum gap between edge of the wafers 11, 12, and at least one of the wafers 11, 12 has a tapered edge. The apparatus separates the wafers 11, 12 bonded mutually by suction. |
