| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of the printed circuit board on which very thin wires are contained with high density where the reliability of connection between a via-post and an upper layer land is enhanced. SOLUTION: In the manufacture for a printed circuit board, having an upper layer conductor with an upper layer wiring by a transfer method on a printed circuit board on the lower layer conductor pattern of which a via-post, is provided via an insulation film, after an upper wire 111a is formed by the transfer method, the surface of the board is polished mechanically, so as to make the surface of a via-post 103b and the upper layer wire 111a flat, and an upper layer land 201 is formed so as to be connected to the via-post 103b and the upper layer wire 111a whose surface is made flat. |
