发明名称 Apparatus and method for washing substrates
摘要 A substrate washing apparatus includes a bath, a washing solution supply source, a first path for allowing the washing solution overflowing from the bath, a rinse solution supply source, a second path for passing the rinse solution, a common path communicating with the first and second paths and also with a bottom of the bath, a first valve, a second valve, a discharge path branched from the first path, and a control section, wherein the first valve includes a first body for opening/closing the first path, a third path arranged parallel to the first path and having a diameter smaller than a diameter of the first path, and a second body for opening/closing the third path, so that the first body is opened and the second body is closed, to allow the washing solution to flow into the bath, and on the other hand, the first body is closed, the second body is opened, to allow the rinse solution to flow into the bath, and the washing solution remaining in the first and third paths is discharged together with the rinse solution through the discharge path.
申请公布号 US5730162(A) 申请公布日期 1998.03.24
申请号 US19960583979 申请日期 1996.01.11
申请人 TOKYO ELECTRON LIMITED 发明人 SHINDO, NAOKI;KITAHARA, SHIGENORI;TOSHIMA, TAKAYUKI;YOKOMIZO, KENJI
分类号 H01L21/00;H01L21/306;H01L21/677;(IPC1-7):B08B13/00 主分类号 H01L21/00
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