| 摘要 |
Forming tungsten plugs allows for a conformal step coverage into contacts in semiconductor wafer processing. By rinsing the wafers after the tungsten etchback but before the wafers have a chance to enter an oxygen-containing environment, the amount of fluorine-containing residue removed from the wafer can be increased. In this way, the connection between the tungsten plugs and a metallization layer can be improved.
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