| 摘要 |
A ladder resistance (1) consisting of resistance elements (r1, r2, . . . , r8) connected in series with intermediate taps (T1, T2, . . . , T7) interposed is so arranged as to be folded back at its midpoint. Pairs of differential comparators (C1 and C7, C2 and C6, . . . ) which are connected to common intermediate taps are each disposed adjacently so as to be nearest to the intermediate tap to be connected thereto. Accordingly, wires connecting the differential comparators (C1, C2, . . . , C7) to the intermediate taps (T1, T2, . . . , T7) become shorter and an area of a semiconductor chip needed for arranging the wires can be reduced. Thus, reduction in area of the semiconductor chip needed for providing the device therein is achieved.
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