| 摘要 |
PROBLEM TO BE SOLVED: To provide a case for containing an object to be processed and a method for transferring the object which needs to be efficiently processed in a highly clean atmosphere at a low cost without dust adhering to the object. SOLUTION: A case 26 comprises a base 30 which can be attached detachably to a process stage 27 and on which a semiconductor wafer 22 can be mounted thereon, and a cover 32 which can be easily attached closely to the upper surface of the base 30. Three threaded holes 36 and three through-holes 38 are formed alternately in the edge of the base 30 at intervals of 60 degrees with respect to the center. The cover 32 is provided with a flange 42, and the flange is provided with through-holes 44 and notch bolt holes, corresponding to the threaded holes 36 and through-holes 38. Thereby, the case 26 holding the semiconductor wafer 22 held therein is transferred, and the cover 32 can be detatched at the next step, therefore, dust is prevented from adhering to the semiconductor wafer 22. |
