Processing head for semiconductor processing machines

摘要

A workpiece support for supporting a semiconductor workpiece in a semiconductor processing machine is disclosed. The workpiece support has an operator base which essentially forms a yoke having two yoke arms. An operator arm having two fork arms is pivotally mounted between the two yoke arms of the operator base such that the fork arms are protruding. A processing head having a workpiece holder is rotatably mounted between the two protruding fork arms. The processing head may rotate about the fork arms to present the workpiece holder in a position to receive a workpiece or to deploy the workpiece in the semiconductor manufacturing process. The operator arm which pivots about the operator base yoke arms is used to lower the processing head and the workpiece into the process. Both the processing head and the operator arm are supported along horizontal axes having at least two points of support distally separated for stability. The processing head is further provided with novel fingers for holding the workpiece in an electroplating process. A method of presenting a workpiece to a semiconductor manufacturing process in accordance with the description provided for the apparatus is also described.