| 摘要 |
PROBLEM TO BE SOLVED: To prevent defects due to dropping of lead frame pieces and resin chip. SOLUTION: The manufacturing process comprises, after preparing a lead frame, forming seal parts 2, outflow resin parts 3 and coupling resin parts 4 on seal-forming regions (front and back surfaces), outflow resin regions 25 (front and back surfaces) and coupling resin region 27 (back surface) and cutting lead frame parts for cutting off the outflow resin parts 3 and coupling resin parts 4. The outflow resin parts are formed by openings 23, having support parts 24 for supporting the outflow resin parts. Holes are formed through the lead frame parts at the coupling resin forming regions. The support parts are cut for cutting off the outflow resin parts 3. the lead frame resin parts 9 to which the coupling resin parts 4 adhere are cut for cutting off the coupling resin parts 4. As the resin enters in the holes, the bond strength of the coupling resin parts 4 and the lead frame parts 9 increases high so that it becomes difficult to peel them off after cutting also. |
