| 摘要 |
PROBLEM TO BE SOLVED: To enable using a higher-power consumption semiconductor element without using radiation fins by a method, wherein a BGA, LGA or CGA package for semiconductor element bonded to a heat conductive insulating material is provided under a circuit board made of a printed board and the entire bonded body formed by bonding together the circuit board, and the package is constiutted into a cavity-up structure. SOLUTION: A large, number of holes are provided in the part, which does not come into contact with a semiconductor element 1 of a heat conductive insulating material substrate 3 having a wiring printed circuit, the pitch of the holes is set at the same pitch as that of outer lead bonding pads under a circuit board 2, and the size of the holes is set in a size larger than that of BGA balls. A normal high-melting point solder is used for the BGA balls 4 which come into contact with the board 2, ceramics are used for the substrates 3, and a metallic plate having an insulating layer or the like is used for the surface of the substrate 3. The board 2 and the substrate 3 are bonded together with a paste-solidifying material containing solder and/or one of silver, platinum, gold and copper or an anisotropic conductive resin solidifying material or the like, whereby even if a package for semiconductor element is not provided with radiation fins, the high-power consumption semiconductor element can be used. |
