发明名称 GATE CUT METHOD OF LIGHT GUIDE PLATE MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To avoid the deterioration of brightness or light permeability of a cut part due to becoming clouded and the like by a method wherein a gate part between a sprue runner and a molded form is cut immediately after injection by a gate cut pin, provided between an ejector pin for extruding the sprue runner and a product ejection pin and equipped with a spring for buffering shock. SOLUTION: Molten resin is filled into a cavity 14 from an injection device. A gate cut pin 12 is pushed forward to separate a sprue runner 9 from a product 10 while resin is still soft immediately after injection. In this case, a spring 13 for buffering shock is acted so that buckling is not generated in the gate cut pin 12 even when an excessive or repeated load is applied on the same. A mold is opened after the filled resin in the cavity 14 is cooled and cured to eject the sprue runner 9 by an ejector pin 7 for pushing out the sprue runner and eject the product 10 by a project ejector pin 8 respectively. According to this method, the cut part will not become clouded and remaining stress or warpage will hardly be generated.
申请公布号 JPH1076553(A) 申请公布日期 1998.03.24
申请号 JP19960250926 申请日期 1996.09.02
申请人 TOSHIBA MACH CO LTD 发明人 ASAOKA JUNICHI;KOGA MITSURU
分类号 G02F1/1335;B29C45/38;B29K33/00;B29L31/00;G02F1/13357;(IPC1-7):B29C45/38;G02F1/133 主分类号 G02F1/1335
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