| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a heat-dissipating device which is high in productivity, small in thickness, and superior in thermal conductivity by a method, wherein a heat pipe is provided to a heat pipe insertion groove cut in a heat receiving slab, then the heat pipe insertion groove is subjected to press working to joint the heat receiving slab and the heat pipe together. SOLUTION: A heat-receiving slab 11 is formed of metal and possessed of a heat pipe insertion groove 12 which is provided to its upside, extending along the center line and where a heat pipe 20 is inserted and jointed together. Heat pipe fixing parts 14 are provided to the upper part of the heat pipe insertion groove 12 extending in the lengthwise direction of the insertion groove 12, so as to secure bonding between the heat-receiving slab 11 and the heat pipe 20 after the heat pipe 20 has been inserted into the insertion groove 12. After the heat pipe 20 has been inserted, the heat pipe fixing parts 14 are pressed from above, whereby the heat pipe 20 is pressed against the pipe insertion groove 12 and flattened. By this setup, the heat pipe 20 is surely fixed to the heat-receiving slab 11, making its outer circumference come into close contact with the heat-receiving slab 11.</p> |
