| 摘要 |
PROBLEM TO BE SOLVED: To make small and even the bubbles produced in solder in packaging time by a method wherein a backside metallic film having a plurality of aperture parts in a predetermined plane shape mutually arranged at the same intervals made of a material not adhesive to solder exposed in inner surface is provided on the backside of a substrate with a circuit made thereon. SOLUTION: A matching circuit 1 made of a conductive metallic film is formed on the surface of a substrate 2, and a back side metallic film 7 made of a conductive metallic film provided on the entire back surface is normally plates with Au, etc. This back metallic film 7 keeps a small rectangular plate shape. In such a constitution, a plurality of aperture parts 8 exposed in the back side of the substrate 2 are arranged in parallel with one another at specified intervals thereby enabling the back metallic film 7 to take a lattice shape. In this case, the backside of the substrate 2 is exposed in the aperture parts 8, but materials which is not bonded with solder may be provided. |
