| 发明名称 |
Lead-free, tin-based multi-component solder alloys |
| 摘要 |
The present invention provides a solder alloy having from about 80-81% tin, from about 2-4% silver, from about 5-6% indium, and from about 10-12% bismuth by weight, and microelectric circuits soldered by this alloy.
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| 申请公布号 |
US5730932(A) |
申请公布日期 |
1998.03.24 |
| 申请号 |
US19960612614 |
申请日期 |
1996.03.06 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SARKHEL, AMIT K.;WOYCHIK, CHARLES GERARD |
| 分类号 |
B23K35/02;B23K35/26;H05K3/34;(IPC1-7):C22C5/04 |
主分类号 |
B23K35/02 |
| 代理机构 |
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