发明名称 |
Ic packaging lead frame for reducing chip stress and deformation |
摘要 |
The present invention relates to a lead frame design for IC packaging to reduce chip stress and deformation and to improve mold filling. The die-pad is split into several sections which are jointed together by flexible expansion joints. The split die-pad allows relative motion between the pad and the chip during die attach cure. It also breaks down the total die pad area (and length) that is rigidly attached to the chip into smaller sections. These two factors reduce the magnitude of coefficient-of-thermal expansion (CTE) mismatch and out of plane deformation of the assembly, resulting in lower chip stress and deformation and improved package moldability. |
申请公布号 |
SG46955(A1) |
申请公布日期 |
1998.03.20 |
申请号 |
SG19950001670 |
申请日期 |
1995.10.28 |
申请人 |
INSTITUTE OF MICROELECTRONICS |
发明人 |
BENG LIM THIAM;BHANDARKAR, SARVOTHAM, M. |
分类号 |
H01L21/56;H01L23/31;H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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