发明名称 |
MODULE METHOD FOR ASSEMBLING IMPLANT |
摘要 |
FIELD: medical engineering. SUBSTANCE: device has endosseous plate 1 and two removable heads 3 connected to the endosseous plate by pins 4 mounted on necks of removable heads 3 along the plane of endosseous plate in parallel relation to one another. Necks 5 are made from endosseous plate segments and have rest platforms 6 positioned in orthogonal relation to the plane of endosseous plate 1 and their diameter is selected to be greater than or equal to removable head diameter. The ends of each pin 4 are attached to rest platform 6 of the corresponding neck. A removable head is made from bushing 3 having longitudinal threaded hole so that ratio of diameter of pin 4 to the thickness of endosseous plate 1 is selected in the range of 1.1-3.1 and ratio of distance between longitudinal axes of the pins to their diameter is selected in the range of 3.0-9.0. EFFECT: several kinds of wound adhesion selectable; enhanced effectiveness in correcting longitudinal tooth axis; lower load on endosseous plate. 14 cl, 8 dwgb
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申请公布号 |
RU2106831(C1) |
申请公布日期 |
1998.03.20 |
申请号 |
RU19960114186 |
申请日期 |
1996.07.16 |
申请人 |
KHLESTKIN JURIJ LEONIDOVICH |
发明人 |
KHLESTKIN JU.L.;KOZLOV O.A.;NABOKO JU.M.;KHLESTKIN JU.L.;KOZLOV O.A.;NABOKO JU.M. |
分类号 |
A61C8/00;(IPC1-7):A61C8/00 |
主分类号 |
A61C8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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