Polierscheibe und ein Verfahren zur Polierung eines Halbleitersubstrats

摘要

The polishing pad for polishing a semiconductor substrate comprises an edge, a number of pores having an average pore size, and a first region that is adjacent to the edge, and a second region having openings. The second region is adjacent to the first region, the second region is further from the edge compared to the first region. Each opening of the number of openings has a width that is in a range of about 25-1000 percent larger than the average pore size.