发明名称 WAFER SCALE HIGH DENSITY PROBE ASSEMBLY, APPARATUS FOR USE THEREOF AND METHODS OF FABRICATION THEREOF
摘要 A structure comprising: a substrate having a surface; a plurality of elongated electrical conductors extending away from said surface; each of said elongated electrical conductors having a first end affixed to said surface and a second end projecting away from said surface; there being a plurality of said second ends; a means for permitting each of said plurality of said second ends to move about reference positions.
申请公布号 WO9811449(A1) 申请公布日期 1998.03.19
申请号 WO1997US16264 申请日期 1997.09.12
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;BEAMAN, BRIAN, SAMUEL;FOGEL, KEITH, EDWARD;LAURO, PAUL, ALFRED;SHIH, DA-YUAN 发明人 BEAMAN, BRIAN, SAMUEL;FOGEL, KEITH, EDWARD;LAURO, PAUL, ALFRED;SHIH, DA-YUAN
分类号 G01R31/26;G01R1/067;G01R1/073;G01R3/00;H01L21/66;(IPC1-7):G01R31/316 主分类号 G01R31/26
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