WAFER SCALE HIGH DENSITY PROBE ASSEMBLY, APPARATUS FOR USE THEREOF AND METHODS OF FABRICATION THEREOF
摘要
A structure comprising: a substrate having a surface; a plurality of elongated electrical conductors extending away from said surface; each of said elongated electrical conductors having a first end affixed to said surface and a second end projecting away from said surface; there being a plurality of said second ends; a means for permitting each of said plurality of said second ends to move about reference positions.
申请公布号
WO9811449(A1)
申请公布日期
1998.03.19
申请号
WO1997US16264
申请日期
1997.09.12
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;BEAMAN, BRIAN, SAMUEL;FOGEL, KEITH, EDWARD;LAURO, PAUL, ALFRED;SHIH, DA-YUAN