| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a non-contact IC card with the usage of a hot-melt adhesive capable of reducing a size of a producing device as well as securing smoothness and thickness accuracy of the card. SOLUTION: In this manufacturing method of the non-contact IC provided with an antenna coil 1a, an electronic part 1 electrically connected to the antenna, and two outer layer resin sheet members 2 stuck to each other with the hot-melt adhesive 3, the card is molded by injecting the melted hot-melt adhesive 3 into a metallic mold 9 wherein the outer layer resin sheet members 2 and the electronic part 1 to be installed are positioned. |
