Improvements in or relating to semiconductor devices

摘要

An embodiment of the instant invention is a method of removing inorganic contamination from substantially the surface of a semiconductor substrate, the method comprising the steps of: reacting the inorganic contamination with at least one conversion agent, thereby converting the inorganic contamination; removing the converted inorganic contamination by subjecting it to at least one solvent agent, the solvent agent is included in a first supercritical fluid (preferably supercritical CO<2>); and wherein the converted inorganic contamination is more highly soluble in the solvent agent than the inorganic contamination.