IMPROVEMENTS RELATING TO INDUCTIVE ASSEMBLIES IN ELECTRONIC CIRCUITS
摘要
An inductive assembly is formed using several substrates joined together around a magnetic core. Each electrical winding of the assembly is formed partly on one substrate and partly on another, having turns of conductor which are completed when the substrates are brought together at right angles. This enables the core to have a one-piece structure which is generally cheaper and more convenient than a conventional multi-piece structure. Multiple assemblies can be formed using a single base substrate to which a number of cores and secondary substrates are attached.
申请公布号
WO9811765(A2)
申请公布日期
1998.03.19
申请号
WO1997NZ00114
申请日期
1997.09.16
申请人
PDL ELECTRONICS LIMITED;HEIN DE BEUN, ARTHUR, JOHANNES;GIVEN, TERENCE, LESLIE
发明人
HEIN DE BEUN, ARTHUR, JOHANNES;GIVEN, TERENCE, LESLIE