| 摘要 |
<p>A silicon transfer switch (10) having a compact and modular arrangement of solid state switch components (14) within the switch boxes (10). The components are arranged in modular half-stack assemblies (14) such that the half-stacks can be loaded into and out of compartments (12) within the switch boxes (10) in an efficient and timely manner. The cooling system minimizes temperature and pressure gradients in the flow of air to the electronic components arranged in the stacks (14) so as to provide uniform cooling of the components. The compact and modular arrangement of the switch components optimizes electrical interconnection between components, mechanical clamping forces, thermal cooling, magnetically coupled solid state switch device firing and temperature management within the system.</p> |
