发明名称 |
Lead frame flash removing method and apparatus |
摘要 |
In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash. <IMAGE> |
申请公布号 |
EP0794559(A3) |
申请公布日期 |
1998.03.18 |
申请号 |
EP19970103573 |
申请日期 |
1997.03.04 |
申请人 |
NEC CORPORATION |
发明人 |
ICHIKAWA, SEIJI;TANAKA, JUNICH;HIROAKWA, TOMOAKI;SATO, TAKU;KIMURA, TOMOAKI;MURATA, SATOSHI;KUBOTA, TSUTOMU;OGIHARA, TAKEO;UCHIDA, KENJI;WATANABE, KENJI;NOGUTI, TSUTOMU |
分类号 |
H01L21/56;H01L21/48;H01L23/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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