Epoxy resin composition for semiconductor sealing,申请号EP19900120007-传众专利搜索

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发明名称	Epoxy resin composition for semiconductor sealing
摘要
申请公布号	EP0428871(B1)	申请公布日期	1998.03.18
申请号	EP19900120007	申请日期	1990.10.18
申请人	SUMITOMO BAKELITE COMPANY LIMITED	发明人	OHTA, KEN;KOSAKA, WATARU;YANAGISAWA, KENICHI
分类号	C08G59/24;C08G59/32;C08G77/42;C08L63/00;C08L83/10;H01B3/40;(IPC1-7):C08L63/00;C08L61/14	主分类号	C08G59/24
代理机构		代理人
主权项
地址

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