Integral copper column contact pad

摘要

The present invention includes an integral copper column contact pad 16 with a solder bump flip chip 10. An integrated circuit chip 10 is provided and includes at least two contact pads 12. A thin layer of barrier metallization 13 is provided over the contact pads. A flexible support substrate 28 is provided having a circuit layer 20 with raised features 22 that include copper traces 16. A solder bump 26 connects the contact pad on the integrated circuit chip and the raised features of the flex circuit to provide an integral copper column with a solder bump flip chip. The copper column may be used as a heat sink path.