| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance production efficiency by preventing moisture absorption for the resin molding of a package and eliminating the drying process. SOLUTION: The package comprises a resin molding 1 of thermosetting resin, e.g. polyimide resin, a CCD chip 4 bonded to the central recess of the resin molding 1, a lead frame 5, a bonding wire 6 for bonding the CCD chip 4 and the lead frame 5, a part 7 for tightly bonding a cover member 8 provided at the upper part of the resin molding 1, and a moisture resistant plate 9. The resin molding 1 is coated on the entire outer circumference thereof, including the central recess, with 20-30μm of a material 10, having moisture permeability lower than that of the resin molding 1. According to the structure, moisture does not intrude into the package through the outer surface of the resin molding 1, and the performance of solid state image sensor can be maintained.</p> |
