| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve accuracy of inspecting ups and downs of semiconductor device leads by preventing ends of leads from being misidentified, due to the occurrence of dark parts in leads depending on the attitude position of a semiconductor device mounted in an emboss. SOLUTION: A side wall of each emboss at a side of a carrier tape 1 is provided with lighting windows 3, through which overall outline of leads 8 of a semiconductor device 6 can be seen. Also a base plate 11 of an apparatus for inspecting the semiconductor device 6 is provided with through-holes 11a connected continuously to the lighting windows 3, and a reflector 9 with a sloped mirror-finished surface is positioned at the front of the through-holes 11a and under a light source 10a, and light of the light source 10a is deflector by the reflector 9 to illuminate the leads 8 of a semiconductor device 6 through the through-holes 11a and the lighting windows 3 of the side wall of each emboss.</p> |
