| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which hermetic seal is protected against deterioration due a metal brazing material creeping up a metal frame for stress relaxation. SOLUTION: The semiconductor device comprises a metal heat plate 1 having semiconductor element mounting part 1a on the upper surface thereof, a metal frame 2 bonded through a metal brazing material 10 onto the upper surface of the heat plate 1, while surrounding the semiconductor element mounting part 1a, a ceramic frame 3 mounted on the upper end of the metal frame 2 and bonded thereto through the metal brazing material 10, a semiconductor element 4 bonded through the metal brazing material 10 to the semiconductor element mounting part 1a on the heat plate 1 surrounded by the ceramic frame 3, and a cover 6 being applied to the opening at the upper end of the ceramic frame 3 bonded with the semiconductor element 4, thus hermetically sealing the space for containing the semiconductor element 4. A receiving part 7a of brazing material 10 is formed on the heat plate 1 at a position lower than the bonding face of the metal frame 2 and the heat plate 1, so that the brazing material 10 flows into the receiving part 7a. |
