Apparatus for the treatment and drying of semiconductor wafers in a fluid

摘要

Provided is a process for removing organic materials from semiconductor wafers and a process for chemical solvent drying of wafers. In the drying process, a wafer submerged in a bath having a lower aqueous layer and an upper organic layer is lifted from the lower aqueous layer up through the upper organic layer and removed from the bath. An apparatus for completing this process is also disclosed.