| 摘要 |
PROBLEM TO BE SOLVED: To obtain the title chip type electronic component capable of avoiding outer electrodes formed notably turning around the surface of a ceramic board or formed notably intruding into secondary splitting trenches. SOLUTION: A coil pattern 11 and leading out electrodes 12, 12 are formed on the surface of a ceramic board 10 further to be covered with a protecting layer 13 while the chip type electronic component provided with external electrodes 15 are formed on both ends as well as trench parts 14, 14 are formed on the protecting layer 13. In such a constitution, the outer electrodes 15 are composed of an underneath layer 15a molded by sputtering, the second layer 15b and the third layer 15c molded by electrolytic plating step so that the turning around on the upper surface of the electrodes 15 may be cut off by the trench parts 14. |
