| 摘要 |
PROBLEM TO BE SOLVED: To grind a wafer evenly, and reduce the loading pressure of grinding members applied to a semiconductor substrate. SOLUTION: A pair of cylindrical drums 24a and 24b are provided on a semiconductor substrate 23 fixed to a wafer holder 22, and the drums 24a and 24b, and the wafer holder 22 are rotated at the same time when grinding solutions 27a and 27b are injected to the contact surfaces under the condition contacting the semiconductor substrate 23 to the drums 24a and 24b at a specific pressure, and the surface of the semiconductor substrate 23 is ground while the drums 24a and 24b are being reciprocated in the lateral direction. |
