| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a packaging method in which the strength of a cap wafer is sustained, even if the density of dies on an element wafer increases bonding pads can be accessed easily and stress onto the element is minimized. SOLUTION: A semiconductor element on an element wafer 30 is packaged using a cap wafer 10. Cavities 27 are formed by a performing partial etching a plurality of times continuously from the surface of the cap wafer 10 to the inside thereof. The partial etching pattern of the cavity 27 depends on the pattern of dies 32 on the element wafer 30. The cap wafer 10 is then aligned with the element wafer 30 and bonded thereto, using glass frit as an adhesive. Thereafter, the thickness of the cap wafer 10 is decreased from the rear side 127, until the rear surface thereof reaches the cavity 27 formed by partial etching. Finally, the element wafer 30 is diced to produce individual dies 32.</p> |
