| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide conductivity, adhesion, wettability, and solder waste resistance with a good balance by using, in a conductive paste composition, Ag having an effective characteristic, or an Ag conductive component such as a mixture or alloy of Ag with other noble metal. SOLUTION: A conductive paste composition for terminal electrode of chip resistor formed by dispersing a conductive component consisting of metal powder and an inorganic binder in a vehicle contains 50-87wt.% of at least one kind selected from the group consisting of silver single body and mixtures and alloys of silver with other noble metal powders. It also contains 3-10wt.% of a glass binder containing no Bi2 O3 and 0.1-15wt.% of a metal oxide, bichloride or boride selected from tin, iridium, rhodium, ruthenium and rhenium alone or in combination of two or more thereof.</p> |
