发明名称 SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF AND RADIATOR FOR USE THEREIN
摘要 PROBLEM TO BE SOLVED: To prevent peeling between a radiator and a resin sealed body. SOLUTION: A pellet mounting part 24 of the radiator 21 is provided with an inside groove 30, an outside groove 31 and holding hole 33; the outside groove 31 is provided with an in-groove engagement part 32, and the holding hole 33 is provided with an in-hole engagement 34 in projection by press working. Resin of a resin-sealing member 39 mounted on the pellet-mounting part 24 of the radiator 21 is held as filled into the inside groove 30, outside groove 31 and holding hole 33, the in-groove engagement 32 is coupled with the resin shaped as filled into the outside groove 31, and the in-hole engagement 34 is coupled with the resin, shaped as filled into the holding hole 33. Holding by the inside groove 30, outside groove 31 and holding hole 33 as well as shaped coupling by the in-groove engagement 32 and in-hole engagement 34 enable prevention of peeling of the resin sealed body 30 from the radiator 21 and also enhance improvement in humidity resistance of a power IC. Since the in-groove engagement 32 and in-hole engagement 34 can be plastically shaped by pressing, increase in its manufacturing cost can be suppressed.
申请公布号 JPH1074867(A) 申请公布日期 1998.03.17
申请号 JP19970123587 申请日期 1997.04.25
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 SATO YUKIHIRO;YAMADA TOMIO
分类号 H01L23/28;H01L23/34;(IPC1-7):H01L23/28 主分类号 H01L23/28
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