发明名称 POLYIMIDE COATING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a polyimide coating device, which is provided with a means which can prevent a polyimide from being wasted, for a semiconductor device. SOLUTION: A polyimide coating device is provided with a buffle sensor 48 for perceiving whether a polyimicle is fed from a polyimide storage tank 40 or not, and an auxiliary storage tank 50 which is always filled with a constant amount of the polyimide. Moreover, as an exhaust tube 52 is coupled with the tank 50, the flow of gas in the tank 50 is prevented from being generated and the gas can be easily exhausted. Thereby, the amount of the polyimide, which is disposed of as a waste fluid, can be minimized. Moreover, as bubbles can be prevented from being included in the polyimide, which is discharged in a nozzle of a feed pipe 46, a defective process is prevented from being carried out in a polyimide coating process to be able to eliminate an excessive waste of the polyimide. Accordingly, the purchase cost of the polyimide can be significantly reduced, thereby, the manufacturing cost of a semiconductor device is reduced.</p>
申请公布号 JPH1074742(A) 申请公布日期 1998.03.17
申请号 JP19970121086 申请日期 1997.05.12
申请人 SAMSUNG ELECTRON CO LTD 发明人 SO KYOSHU;BOKU TAISHIN;HAYASHI DAGIN;TEI SEIICHI
分类号 B05C11/10;B67D7/02;B67D7/76;H01L21/00;H01L21/027;H01L21/31;H01L21/312;(IPC1-7):H01L21/31 主分类号 B05C11/10
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