| 摘要 |
PROBLEM TO BE SOLVED: To surely discriminate a defective substrate by, after two points on a substrate are set as data, recognizing it as a pattern, and then, based on expansion or reduction ratio of substrate calculated from a distance between each two points obtained by that, obtaining deviation between an electrode position on an IC part side and that on a substrate side. SOLUTION: A substrate 1 has arbitrary detection marks 2 and 3 for both part mounting position correction on a substrate and substrate expansion/ reduction ratio calculation, and based on the ratio between the distance between the detection marks 2 and 3 on data and that between marks 4 and 5 on a real substrate, an expansion/reduction ratio of the real substrate is obtained. Considering the expansion/reduction ratio, by converting the data corresponding to an electrode position 6 at the end of one side of a substrate with an IC part-mounting position as the origin on a substrate data, the data corresponding to an electrode position 7 at the end of the actual substrate is calculated, and then the electrode position 6 on the substrate data is compared to the electrode position 7 on the rear substrate, so that based on that difference, a defective substrate caused by the expansion or reduction of the substrate is discriminated. |
