发明名称 LIQUID PHOTOSENSITIVE RESIN COMPOSITION FOR THICK FILM CONDUCTOR CIRCUIT, AND MANUFACTURE OF THICK FILM CONDUCTOR CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition with which the strength of a resin image is imparted while keeping resolution, when used in a thick film conductor circuit, to minimize the bleeding of a component in a resin by using a plurality of specified compounds together as dicarboxylic acid components, and specifying their blending ratios. SOLUTION: A prepolymer is an unsaturated polyester having a number average molecular weight of 500-5000 which is obtained by the condensation of a dicarboxylic acid component and a diol component. The dicarboxylic acid component contains a compound (a) of the formula I in 0.1-0.4 by molar ratio, when the total molar ratio of the dicarboxylic acid components is 1, and a compound (b) of the formula II in 0.1-0.4 by molar ratio. In the formulae, R1 , R2 represent -COOH or -CH2 COOH, and R3 , R4 represent -H or -CH3 . Otherwise, R1 , R3 represent -COOH or -CH2 COOH, and R2 , R4 represent -H or -CH3 .
申请公布号 JPH1073920(A) 申请公布日期 1998.03.17
申请号 JP19960194875 申请日期 1996.07.24
申请人 ASAHI CHEM IND CO LTD 发明人 YOSHIDA KOZO;FURUKAWA SHOICHI
分类号 G03F7/027;G03F7/031;G03F7/038;H05K3/20;H05K3/46;(IPC1-7):G03F7/027 主分类号 G03F7/027
代理机构 代理人
主权项
地址