| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board in which the manufacture process is relative ly simplified and moreover which is high in reliability on connection of heteroge neous surface wiring conductors, concerning a circuit board which is equipped with an Ag conductor film inside the laminate of glass ceramic and an Ag and Au conductive films on the surface. SOLUTION: The circuit board has an Ag inner wiring conductor film 3, and a via hole 4 are arranged inside the laminate 1 consisting of glass ceramic layers 1a-1e and the first Ag surface wiring conductor film 21 and the second Au surface wiring conductor film 22 are arranged on the surface of the laminate 1. First Ag surface wiring conductor film 21 is made, so that the connection part between the first surface wiring conductor film 21 and the second surface wiring conductor film 22 may be directly superposed on one part of the second surface wiring conductor film 22, so that the thickness of the first surface wiring conductor film 21 is more than or equal to one and a half times as large as the thickness of the second surface wiring conductor film 22. |
