| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of the whole of a device and also to reduce the number of componets. SOLUTION: A circuit board 31 provided with light emitting diode chips 32 is arranged on the prescribed position of the projecting part 22a of a lower glass substrate 22 by being cemented. A diffusion reflection plate 36 is stuck to the bottom surface of a lower polarizing plate 26. Then, after lights emitted from the light emitting doiode chips 32 transmit a transparent sealing member 24 or the like, the lights are diffusingly reflected by the diffusion reflection plate 36 and the diffusingly reflected lights are made to be emitted from the surface of a liquid crystal display panel 21 as image lights. |
