| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of an area to be sealed on the surface of a substrate by fastening a semiconductor chip on the rear side of the substrate which has an opening and connecting wires from the semiconductor chip to a wiring on the front surface of the substrate through the opening. SOLUTION: An opening 3 which is smaller than an IC chip 2 is formed in a part of a substrate 1 which corresponds to a place where the IC chip 2 is to be mounted. The IC chip 2 is fastened to a rear face of the substrate 1 and wires 4 are passed through the opening 3 and pads on the IC chip 2 and a wiring on the front surface of the substrate 1 are connected with these wires 4. By this method, an area to be sealed on the front surface of the substrate 1 can be made small and a degree of freedom in wiring on the substrate 1 can be increased and the size of the substrate 1 itself can be reduced and thereby the size of the entire device can be reduced and the cost can be lowered. |
