Semiconductor device mounting on circuit board

摘要

A semiconductor device mounting process involves (a) forming an alloy lead electrode (3) on an electrode connection area (2) of a semiconductor device (1) by laser ablation; (b) soldering the lead electrode (3) to a connection electrode section on a circuit board; and (c) encapsulating the device (1) and the connection electrode section in resin by laser ablation. Also claimed is a semiconductor device mounting process involving (a') positioning an alloy layer (16), provided on one surface of a transparent substrate (17A), opposite an electrode connection area (2) of the semiconductor device (1); (b') irradiating the substrate region facing the electrode connection area (2) with a laser beam (18A) directed at the other surface of the substrate (17A) so that the alloy layer (16) melts to form a lead electrode (3) on the electrode connection area (2); (c') soldering the lead electrode (3) to a connection electrode section of a circuit board; (d') positioning a resin thin film with one of its surfaces opposite the circuit board surface where the device (1) is soldered; and (e') welding the resin film onto the surfaces of the circuit board and the device (1) using a laser beam directed at the other surface of the resin thin film. Preferably, the resin is polyethylene, polypropylene, polyamide or polycarbonate.