Chip card manufacturing method

摘要

In the method, a semiconductor chip module is inserted in a recess (2) in the surface of the card carrier (1), in electrical contact with an inductive signal transmission device provided by an antenna coil (3). The antenna coil, or its end terminations (4) are located within the recess for the semiconductor chip module and wound in a spiral for absorbing the flexure and/or torsion forces in the vicinity of the semiconductor chip module connections.