发明名称 HIGHLY HEAT-CONDUCTIVE COMPOSITE MAGNETIC MATERIAL
摘要 A composite magnetic material containing a soft magnetic powder and an organic binder in which the soft magnetic powder is dispersed and which has an electromagnetic interference suppression effect. Powder having a good heat conductivity is further dispersed in the organic binder to provide a highly heat-conductive composite magnetic material. The composite magnetic material can be used as a material of a heat dissipation sheet of an electronic device or as a material of a heatsink having an electromagnetic interference suppression effect. As the organic binder, thermoplastic polyimide or liquid crystal polymer can be used. As the powder having good heat conductivity, powder of Als2O3, A1N, cubic BN, insulating SiC or heat-conductive reinforcing material (Kapton) can be used.
申请公布号 WO9810632(A1) 申请公布日期 1998.03.12
申请号 WO1997JP03175 申请日期 1997.09.09
申请人 TOKIN CORPORATION;YOSHIDA, SHIGEYOSHI;SATO, MITSUHARU;ONO, NORIHIKO 发明人 YOSHIDA, SHIGEYOSHI;SATO, MITSUHARU;ONO, NORIHIKO
分类号 H01L23/373;H05K1/02;H05K7/20;H05K9/00 主分类号 H01L23/373
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