| 摘要 |
<p>A semiconductor device is provided with a metal substrate, a plurality of wires fixed to the substrate through an insulating layer, and power circuit section electrically connected to the wires. The power circuit section is provided with a plurality of circuit parts which are electrically connected to the wires and respectively united, and a plurality of terminals which are bonded to the wires. Therefore, a highly reliable power semiconductor module is realized at a low cost.</p> |
