Kunststoffgekapseltes Halbleiterbauteil und Verfahren zu dessen Herstellung

摘要

There is disclosed a plastic-packaged semiconductor device and a method of making the same, for mounting the same to a printed circuit board (400) comprising a plastic body (202) and a plurality of leads (204) extending from the body (202), wherein plastic webs (220) are formed between adjacent leads (204) for supporting the leads (204). Furthermore, plastic bumps (222) are formed at the ends of the webs (220) and align with recesses (406) between conductors (402) of wiring patterns on printed circuit boards (400) for aiding in alignment of the leads (204) with the circuit board (400).