发明名称
摘要 PURPOSE:To obtain the subject resin composition freed from sagging or resin during curing and improved in application and drying property, by mixing an epoxy compound with a resol phenol/formaldehyde resin and a specified mixture. CONSTITUTION:100pts.wt. thermosetting resin (A) comprising 5-30pts.wt. epoxy compound of the formula (wherein l, m and n are each 0-2) and 95-70pts.wt. resol/formaldehyde resin is mixed with 100-175pts.wt. mixture (B) of a normally solid acrylic copolymer cationic quat. ammonium salt (a) with a normally solid tert. amine (b) having two 2-hydroxyethyl groups in the molecule in an (a) to (b) ratio of 0.3-0.6.
申请公布号 JP2727078(B2) 申请公布日期 1998.03.11
申请号 JP19880029911 申请日期 1988.02.10
申请人 RISHO KOGYO KK 发明人 MATSUDA YOSHIMUNE
分类号 C08G59/40;C08G59/00;C08G59/04;C08G59/20;C08G59/32;C08G59/64;C08L63/00;C09D5/24;C09D5/25;C09D163/00;G03G15/08;G03G15/16;(IPC1-7):C09D163/00 主分类号 C08G59/40
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