Method of soldering lead wires to ceramic components

摘要

The method involves soldering connector wires to ceramic components. Before soldering, a solder tape (3) provided with a flux agent, is applied to the wire (1) to be soldered. The solder band (3) is preferably attached to the wire (1) using a device (2,4) by means of a mechanical bending process. The solder tape (3) is preferably mechanically fastened to the connection wire (1) using a movable device (2) in which the tape (3) and then the wire (1) are laid, and a counter component (4) which moves relative to the device (2) to bend the tape (3).