发明名称 Oberflächenmontierbares IC-Gehäuse mit integriert montierter Batterie
摘要 An integrated circuit package of the surface-mountable type within which a battery is mounted is disclosed. Battery leads extend from the side of the package body opposite that which is adjacent the circuit board when mounted, and between which a conventional battery may be placed. Standoffs are located on the package body for supporting the battery above the package body, so that a gap is present therebetween. A housing is attached to the package over the battery, and has standoffs attached to its inner surface so that a gap is also present between the housing and the battery. The gaps may be air gaps or filled with a low thermal conductivity material. The gaps thermally insulate the battery from the package body and housing, so that the circuit may be subjected to solder reflow mounting to a circuit board, while insulating the high temperatures from the battery. <IMAGE>
申请公布号 DE69314760(T2) 申请公布日期 1998.03.12
申请号 DE1993614760T 申请日期 1993.12.20
申请人 SGS-THOMSON MICROELECTRONICS, INC., CARROLLTON, TEX., US 发明人 DIXON, CRAIG D., LEWISVILLE, TEXAS 75067, US;HUNDT, MICHAEL J., DOUBLE OAK, TEXAS 75067, US
分类号 H01L25/00;H01L23/495;H01L23/58;H01M2/10;H01M2/20 主分类号 H01L25/00
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