| 摘要 |
An apparatus for mirror-polishing a thin plate (W), wherein uniformity of tightness in a stretched condition across an elastic film (10) can be achieved and a polishing pressure distribution on the thin plate (W) is uniformalized, so that constant polishing stock removal is realized and high flatness polishing is made possible. In the apparatus, the thin plate (W) is held on a thin plate support mounted on a rotatable press member (1) and the thin plate (W) is pressed to a polishing means (21) by the press member (1), and the apparatus has features that a holding surface for the thin plate (W) is formed by a flexible elastic film (10); the elastic film (10) is fastened to the press member (1) or a part mounted thereto in a condition that the elastic film (10) is sandwiched between a spacer (6) and a holding piece (8); and a pressure, which presses the thin plate (W) held on the elastic film (10) to the polishing means (21), is adjusted by applying a back pressure to the thin plate (W) with a fluid feed means, while adjusting tightness of the elastic film (10) by the space (6). <IMAGE> |
